Semiconductor device

ABSTRACT

A semiconductor device including an active mode and a standby mode as operation modes, includes: a first power source line which accepts the supply of power in the active mode; a second power source line which accepts the supply of power in the active mode and the standby mode; a memory circuit to be coupled with the first and second power source lines; and a first switch which electrically couples the first power source line with the second power source line in the active mode and electrically decouples the first power source line from the second power source line in the standby mode. The memory circuit includes a memory array to be coupled with the second power source line, a peripheral circuit to be coupled with the first power source line, and a second switch which electrically couples the first power source line with the second power source line.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a Continuation Application of U.S. patentapplication Ser. No. 15/389,192, filed on Dec. 22, 2016, which is aContinuation Application of U.S. patent application Ser. No. 14/866,544,filed on Sep. 25, 2015, now U.S. Pat. No. 9,559,693 B2, issued on Jan.31, 2017, which is based on and claims priority to Japanese PatentApplication No. 2014-223178 filed on Oct. 31, 2014 and which isincorporated herein by reference in its entirety.

BACKGROUND

The present disclosure relates to a semiconductor device, and inparticular relates to power source control of the semiconductor devicewhich includes an active mode and a standby mode as operation modes.

The semiconductor device such as a microcomputer and so forth includes apower source circuit adapted to generate a power source voltage(hereinafter, also referred to as an internal power source voltage) tobe supplied to an internal circuit. In the semiconductor devices soconfigured, one semiconductor device which is configured to switch apower source circuit to be operated depending on whether thesemiconductor device is in operation (in the active mode) or is put onstandby (in the standby mode) is widely used in order to implementhigh-speed operation and low power consumption.

It is necessary for the power source circuit to generate a stable powersource voltage in the both operation modes of the active mode and thestandby mode of the semiconductor device. For this purpose, in theactive mode that the power consumption is high and a voltage drop isliable to occur, a power source circuit which is high in power supplyingcapability is used, while in the standby mode that the power consumptionis low, a power source circuit which is reduced in power consumption isused for implementing low power consumption.

In a chip with multiple power sources, it is necessary to sequentiallyrise a plurality of power source voltages in accordance with a powersource start-up sequence which has been defined in advance so as not tocause such a defect that respective circuits are biased in a forwarddirection in power-on. Control of this power source start-up sequenceimposes restrictions on users.

In this respect, a configuration that a switch circuit is provided so asnot to cause the defect that the circuits are biased in the forwarddirection regardless of the power on sequence is disclosed (see JapaneseUnexamined Patent Application Publication No. 2014-130406).

Specifically, there is proposed the switch circuit configured toshort-circuit a supply path of a power source voltage to a memory cellof a memory array and a supply path of a power source voltage for aperipheral circuit in the active mode and to supply only the powersource voltage to the memory cell of the memory array and to shut downthe supply path of the power source voltage for the peripheral circuitin the standby mode.

SUMMARY

However, in general, the above-mentioned switch circuit is provided onthe power source circuit side. Therefore, there is the possibility thata potential difference may be generated by wiring resistance on theinternal circuit side of a semiconductor device to be coupled with twokinds of power source lines. Thereby, there is the possibility that amalfunction, a leakage current and so forth may be generated.

The present disclosure has been made in order to solve theabove-mentioned drawbacks and aims to provide a semiconductor devicewhich causes no defects regardless of the power-on sequence.

Other drawbacks to be solved and novel features of the presentdisclosure will become apparent from description of the specificationand the appended drawings of the present disclosure.

According to one embodiment of the present disclosure, there is provideda semiconductor device including an active mode and a standby mode asoperation modes. The semiconductor device includes a first power sourceline which accepts the supply of power in the active mode, a secondpower source line which accepts the supply of power in the active modeand the standby mode, a memory circuit to be coupled with the first andsecond power source lines and a first switch which electrically couplesthe first power source line with the second power source line in theactive mode and electrically decouples the first power source line fromthe second power source line in the standby mode. The memory circuitincludes a memory array to be coupled with the second power source line,a peripheral circuit to be coupled with the first power source line anda second switch which electrically couples the first power source linewith the second power source line in the active mode and electricallydecouples the first power source line from the second power source linein the standby mode. The first and second switches each includes a firstPMOS transistor a source and an N-type well of which are to be coupledto the first power source line and a second PMOS transistor a source andan N-type well of which are to be coupled to the second power sourceline and a drain of which is to be coupled to a drain of the first PMOStransistor.

According to one embodiment of the present disclosure, it is possible toimplement the semiconductor device which causes no defect regardless ofthe power-on sequence.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram illustrating one example of a general configurationof a semiconductor device 100 according to one embodiment.

FIG. 2 is a diagram illustrating one example of configurations of amemory array MA, a peripheral circuit 20 and a power source shutdowncontrol circuit 40 according to the embodiment.

FIG. 3 is an explanatory diagram illustrating one example of potentiallevels in power-on according to the embodiment.

FIG. 4 is an explanatory diagram illustrating one example of potentiallevels in power-shutdown in the standby mode.

FIG. 5 is an explanatory sectional diagram schematically illustratingone example of a configuration of a switch 15 according to theembodiment.

FIG. 6 is an explanatory diagram illustrating one example of a layoutconfiguration of a switch 30 according to the embodiment.

FIG. 7 is an explanatory diagram illustrating one example of a generallayout of the semiconductor device 100 according to the embodiment.

FIG. 8 is a diagram illustrating one example of a general configurationof a semiconductor device 100# according to an altered example of theembodiment.

DETAILED DESCRIPTION

One embodiment of the present disclosure will be described in detailwith reference to the drawings. Incidentally, the same numerals areassigned to the same or corresponding parts and repetitive descriptionthereof is omitted.

FIG. 1 is a diagram illustrating one example of a general configurationof the semiconductor device 100 according to the present embodiment.

Referring to FIG. 1, the semiconductor device 100 includes a logiccircuit 50, a memory circuit 10 including memory cells, a VDD powersource regulator 60 which receives an external power source voltage VCCQsupplied from the outside, steps down the external power source voltageVCCQ and generates a first internal power source voltage (a voltageVDD), an SVDD power source regulator 80 which steps down the externalpower source voltage VCCQ and generates a second internal power sourcevoltage (a voltage SVDD), a power source shutdown control circuit 40,the switch 15 and so forth.

The SVDD power source regulator 80 supplies the voltage SVDD to a powersource line SVL.

The VDD power source regulator 60 supplies the voltage VDD to a powersource line VL.

The logic circuit 50 is coupled with the power source line VL andoperates by accepting the supply of the voltage from that power sourceline VL.

The memory circuit 10 is coupled with the power source line VL and thepower source line SVL and operates by accepting the supply of thevoltages from the power source lines VL and SVL.

The switch 15 includes P channel MOS transistors 16 and 17.

The P channel MOS transistors 16 and 17 are coupled in series with eachother between the power source line SVL and the power source line VL.

The memory circuit 10 includes the memory array MA including the memorycells, the peripheral circuit 20, the switch 30 and so forth.

The memory array MA is coupled with the power source line SVL andoperates by accepting the supply of the voltage from the power sourceline SVL.

The peripheral circuit 20 is coupled with the power source line VL andoperates by accepting the supply of the voltage from the power sourceline VL. The switch 30 includes P channel MOS transistors 31 and 32.

The P channel MOS transistors 31 and 32 are coupled in series with eachother between the power source line SVL and the power source line VL.

The power source shutdown control circuit 40 generates and outputscontrol signals for controlling the switches 15 and 30. Specifically,the power source shutdown control circuit 40 generates control signalsPWSSP and PWSPP on the basis of a control command PWSS and voltagelevels of the power source line SVL and the power source line VL.

The control signal PWSSP is input into gates of the P channel MOStransistors 16 and 31.

The control signal PWSPP is input into gates of the P channel MOStransistors 17 and 32.

Specifically, the power source shutdown control circuit 40 generates thecontrol signals such that the switches 15 and 30 conduct and the powersource line VL and the power source line SVL are short-circuited in theactive mode, and generates the control signals such that the switches 15and 30 become nonconductive and a short-circuit of the power source lineVL and the power source line SVL is decoupled in the standby mode thatthe power from the VDD power source regulator 60 is shut down.

Thereby, the voltage supply to the peripheral circuit 20 of the memorycircuit 10 is stopped in the standby mode and therefore the voltage SVDDis supplied only to the memory array MA via the power source line SVL.Therefore, it is possible to promote a reduction in standby current.

FIG. 2 is an explanatory diagram illustrating one example ofconfigurations of the memory array MA, the peripheral circuit 20 and thepower source shutdown control circuit 40 according to the embodiment.

As illustrated in FIG. 2, the memory array MA includes a plurality ofmemory cells 1 which have been arranged in a matrix. Each memory cell 1is an SRAM (Static Random Access Memory) which has been provided so asto be rewritable. In the example in FIG. 2, a six-transistor SRAM cellis illustrated. Since details of the SRAM cell are well known, detaileddescription thereof is omitted. An access transistor is electricallycoupled with a corresponding word line WL. The access transistor becomesconductive in accordance with the word line WL which has been activatedwhen executing data reading from or data writing into the memory cell 1concerned.

Each memory cell 1 is coupled with the power source line SVL so as to beelectrically coupled with a source of a voltage SVDD to be supplied fromthe power source line SVL and a source of a ground voltage (a fixedvoltage) VSS. In the example in FIG. 2, memory cells 1 which arearranged in a matrix of two rows by two columns are illustrated.

The plurality of word lines ML are provided respectively correspondingto the memory cell rows of the memory array MA.

In addition, a plurality of sets of bit line pairs are providedrespectively corresponding to the columns of memory cells 1 of thememory array MA. In the example in FIG. 2, two columns of memory cells 1are illustrated. Two sets of bit line pairs BT, BB are providedcorresponding to the two columns of memory cells 1.

The peripheral circuit 20 includes an I/O circuit 2, a driver anddecoder 17 and so forth.

The I/O circuit 2 includes a pre-charge circuit 3, a selection circuit4, a write driver 5, a sense amplifier 6 and so forth which are providedfor every column of the memory cells 1. The I/O circuit 2 is coupledwith the power source line VL and a voltage VDD is supplied to the I/Ocircuit 2.

The pre-charge circuit 3 equalizes the corresponding bit line pair andsets the voltage thereof to the voltage VDD of the power source line VLin data reading.

The selection circuit 4 selects the bit line pair concerned inaccordance with decode signals Y1 and Y0.

In the example in FIG. 2, the decode signals Y1 and Y0 are generated onthe basis of one-bit column address data by a not illustrated columndecoder.

The selection circuit 4 couples the bit line pair BT, BB concerned witha data line pair CBT, CBB in accordance with the decode signals Y1 andY0.

When the decode signals Y1 and Y0 are “0s” (“L” levels), the pre-chargecircuit 3 is activated, couples together and equalizes the bit line pairBT and BB, and electrically couples the bit lines pair BT and BB with asource of the voltage VDD.

The write driver 5 writes data into the memory array MA in accordancewith write data in data writing. Specifically, the write driver 5 isactivated in accordance with an activation signal and drives the bitline pair BT, BB concerned on the basis of the write data.

The sense amplifier 6 outputs read data from the memory array MA in datareading. Specifically, in data reading, the sense amplifier 6 amplifiesa difference between potentials transmitted to the bit line pair andoutputs the read data in accordance with data that the memory cell 1concerned holds.

The driver and decoder 17 is coupled with the power source line VL andoperates by accepting the supply of the voltage VDD.

The driver and decoder 17 includes an address recorder 21 whichpre-decodes a row address signal, a plurality of driver units 22provided corresponding to the plurality of word lines WL which have beenprovided respectively corresponding to the rows of memory cells 1 and soforth.

The address decoder 21 pre-decodes a high-order bit on the basis of therow address signal and, as a result, outputs a pre-decode signal XU. Inaddition, the address decoder 21 pre-decodes a low-order bit of the rowaddress signal and, as a result, outputs a pre-decode signal XL.

The driver unit 22 includes an NAND circuit ND which outputs a selectionsignal on the basis of the pre-decode signal XU and the pre-decodesignal XL, a P channel MOS transistor PT and an N channel MOS transistorNT which drive the word line WL on the basis of the selection signalfrom the NAND circuit ND and so forth.

The P channel MOS transistor PT and the N channel MOS transistor NT arecoupled between a word power source line LCVDD and the source of theground voltage VSS and a coupling node between the transistors PT and NTis electrically coupled with the word line WL.

When the selection signal from the NAND circuit ND is “0” (the “L”level), the P channel MOS transistor PT conducts and the word powersource line LCVDD and the word line WL are electrically coupled witheach other.

When the selection signal from the NAND circuit ND is “1” (a “H” level),the N channel MOS transistor NT conducts and the source of the groundvoltage VSS and the word line WL are electrically coupled with eachother.

Incidentally, in general, from the viewpoint of attaining operationalstability of the memory cell 1, the same potential as that of the memorycell 1 is supplied to the word line WL. Accordingly, the source of thevoltage SVDD for memory cell is coupled to a source and a back gate ofthe P channel MOS transistor PT of the driver unit 22.

Next, a word line fixing circuit 11 will be described. The word linefixing circuit 11 is driven with the voltage SVDD.

The word line fixing circuit 11 includes a plurality of fixingtransistors 12 provided respectively corresponding to the plurality ofword lines WL, a control circuit 13 which generates a word line fixingsignal LCMWD, a power source line drive circuit 14 which drives the wordpower source line LCVDD, a delay element 16, an inverter 15 and soforth.

The delay element 16 delays a signal for a fixed period of time by usinga resistor or an inverter and so forth. Incidentally, the delay element16 may be formed on the basis of a wiring resistance without forming aphysical circuit.

The control circuit 13 includes inverters 25A and 25B, a NAND circuit25D and so forth.

The inverter 25A accepts input of the control signal PWSSP.

The inverter 25B outputs a control signal LM obtained by inverting anoutput signal from the inverter 25A.

The power source line drive circuit 14 is driven with the control signalLCM.

The power source line drive circuit 14 includes a P channel MOStransistor 14A and an N channel MOS transistor 14B which have beenprovided between the sources of the voltage SVDD and the ground voltageVSS.

A coupling node between the P channel MOS transistor 14A and the Nchannel MOS transistor 14B is coupled with the word power source lineLCVDD. Gates of the P channel MOS transistor 14A and the N channel MOStransistor 14B accept input of the control signal LCM.

When the control signal LCM is “0” (the “L” level), the P channel MOStransistor 14A conducts and the word power source line LCVDD and thesource of the voltage SVDD are electrically coupled with each other.

When the control signal LCM is “1” (the “H” level), the N channel MOStransistor 14B conducts and the word power source line LCVDD and thesource of the ground voltage VSS are electrically coupled with eachother.

The control signal LCM is input into one input node of the NAND circuit25D via the inverter 15 and the delay element 16.

Another input node of the NAND circuit 25D accepts input of an outputsignal from the inverter 25A.

The NAND circuit 25D outputs a result of NAND logic arithmetic operationof the output signal from the inverter 25A and a signal transmitted viathe delay element 16 and so forth as the word line fixing signal LCMWD.

The power source shutdown control circuit 40 includes inverters 41 and42, a NAND circuit 43 and so forth.

The inverter 41 outputs an inverted signal of a signal transmitted viathe power source line SVL as the control signal PWSPP in accordance withthe voltage level of the power source line SVL. Specifically, theinverter 41 sets the control signal PWSPP to the “L” level when thevoltage level of the power source line SVL has reached the “H” level.

The inverter 42 outputs an inverted signal of a control command PWSS toone of input nodes of the NAND circuit 43 in accordance with the controlcommand PWSS. The control command PWSS is a command for controlling thestandby mode and the active mode, and is set to the “H” level in thestandby mode and is set to the “L” level in the active mode.

The NAND circuit 43 outputs a result of NAND logic arithmetic operationof the output signal from the inverter 42 and the voltage level of thepower source line VL as the control signal PWSSP.

In the example in FIG. 2, since the power source shutdown controlcircuit 40 outputs the control signal PWSPP (the “L” level) when thevoltage level of the power source line SVL has reached the “H” level,the P channel MOS transistor 32 is in a conductive state. In addition,since, in the active mode, the control command PWSS is set to the “L”level, the output from the inverter 42 is set (maintained) at the “H”level. Accordingly, since the NAND circuit 43 outputs the control signalPWSSP (the “L” level) when the voltage level of the power source lineSVL is the “H” level, the P channel MOS transistor 31 is in theconductive state. Accordingly, in the active mode, both of the P channelMOS transistors 31 and 32 are in the conductive states and the powersource lines VL and SVL are in a short-circuited state.

On the other hand, since, in the standby mode, the control command PWSSis set to the “H” level, the NAND circuit 43 sets the P channel MOStransistor 31 to a non-conductive state in order to output the controlsignal PWSSP (the “H” level). Also when the voltage level of the powersource line VL has reached the “L” level, the NAND circuit 43 sets the Pchannel MOS transistor 31 to the non-conductive state in order to outputthe control signal PWSSP (the “H” level). Accordingly, since in thestandby mode, the P channel MOS transistor 31 is in the non-conductivestate, the power source lines VL and the SVL are in mutually decoupledstates.

FIG. 3 is an explanatory diagram illustrating one example of potentiallevels in power-on according to the embodiment.

As illustrated in FIG. 3, an operation when the voltage SVDD has beenpowered on first will be described.

First, a case where both of the voltage VDD and the voltage SVDD are notpowered on (both are at the “L” level) will be described.

Since the voltage is not also applied to an N type well N-Well of thetransistor concerned, no signal is transmitted to the transistor and allof the control signal LCM, the word line fixing signal LCMWD, signalstransmitted via the word power source line LCVDD and the word line WL,and the pre-decode signals XU and XL are in indefinite states.

Next, a case where the voltage SVDD has been powered on and thepotential thereof has shifted to the “H” level is illustrated. Thereby,the voltage is applied to the N type well N-Well of the transistor towhich the source of the voltage SVDD has been coupled and a signal of acircuit to which the source of the voltage SVDD has been coupled ispropagated.

In case of the example in FIG. 3, the voltage VDD for the peripheralcircuit maintains the “L” level state.

The power source shutdown control circuit 40 sets the control signalPWSPP to the “L” level in accordance with rising of the voltage SVDD. Onthe other hand, since the voltage VDD maintains the “L” level state, thepower source shutdown control circuit 40 sets the control signal PWSSPto the “H” level.

Accordingly, in this case, the P channel MOS transistors 31 and 32 ofthe switch 30 do not conduct.

On the other hand, the control circuit 13 sets the control signal LCM tothe “H” level in accordance with the control signal PWSSP. Thereby, theN channel MOS transistor 14B of the power source line drive circuit 14conducts and electrically couples the word power source line LCVDD withthe source of the ground voltage VSS.

In addition, the NAND circuit 25D of the control circuit 13 sets theword line fixing signal LCMWD to the “H” level in accordance with inputof the signal (the “L” level) according to the potential of the voltageVDD.

The fixing transistor 12 conducts in accordance with the word linefixing signal LCMWD (the “H” level) and electrically couples the wordline WL with the source of the ground voltage VSS. The word line WL isset to the “L” level.

Thereby, even when the voltage source SVDD has been powered on earlierthan the voltage VDD in power-on, the word line WL is set to the “L”level and therefore the access transistor of the memory cell 1 comesinto the nonconductive state.

Accordingly, the potential of the word line WL does not becomeindefinite.

Incidentally, a case where the potential of the word line WL has becomeindefinite hypothetically will be described. When the voltage SVDD ispowered on, the voltage SVDD is applied to any one of internal nodes inaccordance with action of cross-coupling of the inverters of the memorycell 1.

On the other hand, the voltage VDD is set to the “L” level.

Here, when the potential of the word line WL becomes indefinite, thereis the possibility that a through-current may flow between the source ofthe voltage SVDD which has been applied to the internal node of thememory cell 1 and the back gate of the P channel MOS transistor of thepre-charge circuit 3 to which the source of the voltage VDD (the “L”level) used for the electrically coupled peripheral circuit or the backgate of the P channel MOS transistor of the selection circuit 4 via theaccess transistor.

Therefore, as in the configuration according to the embodiment, it ispossible to suppress flowing of the through-current between the voltageSVDD source and the voltage VDD source and to avoid generation ofdefects such as a malfunction, a failure and so forth by fixing the wordline WL to the “L” level.

Then, the power source shutdown control circuit 40 sets the controlsignal PWSSP to the “L” level in accordance with rising of the voltageVDD. Thereby, the P channel MOS transistors 31 and 32 of the switch 30conduct and the power source line VL and the power source line SVL arebrought into the short-circuited state.

In addition, the control signal LCM and the word line fixing signalLCMWD are set to the “L” level. In addition, the address decoder 21 isinitialized and the pre-decode signals XU and XL are set to the “L”level.

On the other hand, also when the voltage VDD has been powered on earlierthan the voltage SVDD, the address decoder 21 is initialized and thepre-decode signals XU and XL are set to the “L” level.

Thereby, the N channel MOS transistor NT of the driver unit 22 conductsand the word line WL is electrically coupled with the ground voltage VSSsource. Accordingly, since the word line WL is set to the “L” level, itdoes not become indefinite and no through-current flows between thevoltage VDD source and the voltage SVDD source.

Owing to the configuration according to the embodiment, it becomespossible to drive the circuit concerned with no generation of defectsregardless of the order of powering on the power sources of the voltageVDD and the voltage SVDD and it becomes possible for circuit designersand others to implement a circuit configuration which is easilydesigned.

FIG. 4 is an explanatory diagram illustrating one example of potentiallevels in power-shutdown in the standby mode.

As illustrated in FIG. 4, an operation when the voltage VDD has beenshut down will be described.

First, a case where both of the voltage VDD and the voltage SVDD arebeing powered on is illustrated.

Next, a case where the voltage VDD from the VDD power source regulator60 is shut down and the potential thereof shifts to the “L” level isillustrated.

In addition, a state where the control command PWSS has risen up to the“H” level is illustrated.

Thereby, the power source shutdown control circuit 40 sets the controlsignal PWSSP to the “H” level. On the other hand, since the voltage SVDDmaintains the “H” level state, the control signal PWSPP maintains the“L” level state.

Accordingly, in this case, the P channel MOS transistor 31 of the switch30 becomes nonconductive and the short-circuit between the power sourceline VL and the power source line SVL is decoupled.

Then, the control circuit 13 sets the control signal LCM to the “H”level in accordance with the control signal PWSSP. Thereby, the Nchannel MOS transistor 14B of the power source line drive circuit 14conducts and electrically couples the word power source line LCVDD withthe ground voltage VSS source.

In addition, the NAND circuit 25D of the control circuit 13 sets theword line fixing signal LCMWD to the “H” level in accordance with inputof the signal (the “L” level) according to the potential of the controlcommand PWSS.

The fixing transistor 12 conducts in accordance with the word linefixing signal LCMWD (the “H” level) and electrically couples the wordline WL with the ground voltage VSS source. The word line WL is set tothe “L” level.

Thereby, since the word line WL is set to the “L” level, the accesstransistor of the memory cell 1 is brought into the nonconductive state.Accordingly, the potential of the word line WL does not becomeindefinite.

Next, a case where the voltage VDD is supplied from the VDD power sourceregulator 60 and the potential thereof has shifted to the “H” level isillustrated.

In addition, a state where the control command PWSS has fallen to the“L” level is illustrated.

Thereby, the power source shutdown control circuit 40 sets the controlsignal PWSSP to the “L” level. On the other hand, since the voltage SVDDmaintains the “H” level state, the control signal PWSPP maintains the“L” level state.

Accordingly, in this case, the P channel MOS transistors 31 and 32 ofthe switch 30 conduct and the power source line VL and the power sourceline SVL are short-circuited.

In addition, the control signal LCM and the word line fixing signalLCMWD are set to the “L” level. In addition, the address decoder 21 isinitialized and the pre-decode signals XU and XL are set to the “L”level.

<Configuration of Switch>

FIG. 5 is a sectional diagram schematically illustrating one example ofa configuration of the switch 15 according to the embodiment.

Referring to FIG. 5, the P channel MOS transistors 16 and 17 are formedin the N type wells N-Well provided in a P type semiconductor substrateP-Sub. A source S of the P channel MOS transistor 16 is coupled to thepower source line SVL and a drain D thereof is coupled to a drain D ofthe P channel MOS transistor 17. The N type well N-Well that the Pchannel MOS transistor 16 is formed is coupled to the power source lineSVL.

A source S of the P channel MOS transistor 17 is coupled to the powersource line VL and the drain D thereof is coupled to the drain D of theP channel MOS transistor 16. The N type well N-Well that the P channelMOS transistor 17 is formed is coupled to the power source line VL.

When the semiconductor device 100 is powered on, the SVDD power sourceregulator 80 and the VDD power source regulator 60 are respectivelystarted and thereby the voltage SVD and the voltage VDD respectivelyrise. The P channel MOS transistor 16 receives the voltage SVDD in thesource S and the N type well N-Well. The P channel MOS transistor 17receives the voltage VDD in the source S and the N type well N-Well.

Here, a case where rising of the voltage SVDD is slower than rising ofthe voltage VDD is supposed. In this case, in the P channel MOStransistor 17, even when the voltage VDD is at the “H” level, the Pchannel MOS transistor 17 is not turned on until the voltage SVDD risesup to the “H” level. Therefore, the drain D of the P channel MOStransistor 17 is brought into a high impedance state.

On the other hand, in the P channel MOS transistor 16, even when thevoltage VDD is at the “H” level, the control signal PWSPP is not set tothe “L” level until the voltage SVDD rises up to the “H” level.Therefore, the P channel MOS transistor 16 is not turned on. Since thedrain D of the P channel MOS transistor 16 is still in the highimpedance state even in such a state, a PN junction between the drain Dand the corresponding N type well N-Well is not biased in a forwarddirection. Therefore, no current flows through the PN junction.

Incidentally, also when rising of the voltage SVDD is slower than risingof the voltage VDD, the same may be said. In this case, in the P channelMOS transistor 17, since a PN junction between the drain D and thecorresponding N type well N-Well is not biased in the forward direction,no current flows through the PN junction.

The PN junction of each of the P channel MOS transistors 16 and 17 isnot biased in the forward direction regardless of which one of thevoltage SVDD and the voltage VDD rises up to the “H” level first asdescribed above. Accordingly, since the restriction on the power sourcestart-up sequence becomes unnecessary, it becomes possible to drive thecircuit with no generation of defects regardless of the power-onsequence.

Incidentally, although in the example in FIG. 5, description has beenmade by using the configuration of the switch 15, the same applies tothe configuration of the switch 30.

FIG. 6 is an explanatory diagram illustrating one example of a layoutconfiguration of the switch 30 according to the embodiment.

As illustrated in FIG. 6, in this example, a configuration that theswitches have been provided around a memory cell region of the memoryarray MA is illustrated by way of example.

Specifically, the N type well N-Well is provided in a peripheral regionof a P type well P-Well to which the voltage VSS is to be supplied andthe voltage SVDD is to be supplied to the N type well N-Well concerned.

In the N type well N-Well to which the voltage SVDD is to be supplied,the P channel MOS transistor which configures the memory cell 1 and theP channel MOS transistor which configures the driver unit 22 areprovided.

In addition, the P channel MOS transistor 31 is formed in the N typewell N-Well. A source of the P channel MOS transistor 31 is coupled withthe power source line SVL. A drain of the P channel MOS transistor 31 iscoupled with a drain of the P channel MOS transistor 32.

The P channel MOS transistor 32 is provided in an outer side N type wellN-Well. The voltage VDD is to be supplied to that outer side N type wellN-Well. The outer side N type well N-Well to which the voltage VDD is tobe supplied is shared with the peripheral circuit 20 and the P channelMOS transistor which configures the peripheral circuit 20 is provided inthe outer side N type well N-Well.

A source of the P channel MOS transistor 32 is coupled with the powersource line VL.

In the example in FIG. 6, a configuration that the plurality of switches30 have been provided around the memory cell region of the memory arrayMA is illustrated.

Both of the P channel MOS transistors 31 and 32 of the switch 30concerned conduct, thereby the power source lines are short-circuitedand the common voltage is supplied to the wells.

In the example in FIG. 6, the configuration that the P channel MOStransistor 31 has been provided in the memory cell region isillustrated. That is, the configuration that since the memory cellregion is formed in the N type well N-Well to which the voltage SVDD isto be supplied, the P channel MOS transistor 31 has been provided in theN type well N-Well to which the same voltage SVDD is to be supplied andthe P channel MOS transistor 32 has been provided in the outer side Ntype well N-Well to which the voltage VDD is to be supplied isillustrated.

Owing to the above-mentioned configuration, it is possible to promoteefficiency of the layout area by providing the P channel MOS transistor31 in the memory cell region.

If it is intended to provide the P channel MOS transistor 31 in a regionlocated on the outer side of the memory cell region, it will benecessary to provide the N type well N-Well that the P channel MOStransistor 31 is to be formed and to which the voltage SVDD is to besupplied separately from the N type well N-Well to which the voltage VDDis to be supplied. In general, it is necessary to leave a wider spacefor separation between the N type wells N-Well which are different fromeach other in potential level and the layout area of the switches 30 isincreased to that extent.

In the example in FIG. 6, since the N type well N-Well which is formedseparately from the outer side N type well N-Well which is formed on theperiphery of the memory cell region and to which the voltage VDD is tobe supplied and to which the voltage SVDD is to be supplied is utilized,it is possible to reduce the area of the switches as mentioned above.

FIG. 7 is an explanatory diagram illustrating one example of a generallayout of the semiconductor device 100 according to the embodiment.

As illustrated in FIG. 7, the plurality of switches 30 are arrangedaround the memory array MA. Then, in this circumstance, the P channelMOS transistors 31 and the P channel MOS transistors 32 which configurethe switches 30 in pairs are provided so as to surround the outerperiphery (upper, lower and right sides) of the memory array MA.

The P channel MOS transistors 31 are provided in the memory cell regionand mutually share the N type well N-Well to which the voltage SVDD isto be supplied. In addition, the P channel MOS transistors 32 areprovided in the outer side N type well N-Well to which the voltage VDDis to be supplied and therefore are formed on the outer side of thememory cell region. The I/O circuit 2 shares the outer side N type wellN-Well to which the voltage VDD is to be supplied with the P channel MOStransistors 32.

Incidentally, since the driver and decoder 17 and the word line fixingcircuit 11 share the power source with the memory array MA, the switch30 is not arranged on an outer peripheral part (the left side) of thememory array MA on which the driver and decoder 17 and the word linefixing circuit 11 are provided.

In addition, in the example in FIG. 7, the power source line VL and thepower source line SVL are short-circuited on the side closer to thememory cell region by configuring so as to provide the plurality ofswitches 30 between the power source line VL and the power source lineSVL. Thereby, it is possible to supply the voltages of the same voltagelevel by suppressing generation of a potential difference caused bypower source wiring.

Thereby, it is possible to suppress generation of the malfunction andthe leakage current.

<Altered Example>

FIG. 8 is a diagram illustrating one example of a general configurationof a semiconductor device 100# according to an altered example of thepresent embodiment.

Referring to FIG. 8, the semiconductor device 100# is different from thesemiconductor device 100 in that a plurality of memory circuits havebeen additionally provided. Specifically, the semiconductor device 100#has a configuration that memory circuits 10A to 10C have been providedand the memory circuits 10A to 10C. The memory circuits 10A to 10C areconfigured so as to mutually share the power source lines VL and SVL.

The memory circuits 10A to 10C respectively include switches 30A to 30C.

The switches 30A to 30C have the same function as the switch 30.

Accordingly, in the configuration that the plurality of memory circuits10A to 10C are provided, loads caused by, in particular, the wiringresistance are made different from one another and a potentialdifference is liable to generate. However, by a configuration that theswitch for short-circuiting the power source line VL and the powersource line SVL is provided in each memory circuit, the power sourcelines VL and the SVL are short-circuited on the side closer to thememory cell region and thereby it is possible to supply the voltages ofthe same voltage level by suppressing generation of a potentialdifference caused by the power source wiring.

Although, in the foregoing, the present disclosure has been specificallydescribed on the basis of the embodiment, it goes without saying thatthe present disclosure is not limited to the embodiment and it ispossible to alter and modify the present disclosure in a variety of wayswithin a scope not deviating from the gist of the present disclosure.

What is claimed is:
 1. A semiconductor device comprising: a first powersource line for supplying a first voltage; a second power source linefor supplying a second voltage; a memory circuit coupled with the firstand second power source lines; and a first switch which electricallycouples the first power source line with the second power source lineand electrically decouples the first power source line from the secondpower source line, in response to a control signal, wherein the memorycircuit includes a memory array coupled with the second power sourceline, a peripheral circuit coupled with the first power source line, anda second switch which electrically couples the first power source linewith the second power source line and electrically decouples the firstpower source line from the second power source line, in response to thecontrol signal, and wherein the first and second switches each includesa first PMOS transistor arranged in a first N-type well, a source of thefirst PMOS transistor coupled to the first power source line, and asecond PMOS transistor arranged in a second N-type well, a source of thesecond PMOS transistor coupled to the second power source line and adrain of the second PMOS transistor is to be coupled to a drain of thesecond PMOS transistor, and wherein the first N-type well iselectrically separated with the second N-type well.
 2. The semiconductordevice according to claim 1, wherein the first N-type well is coupled tothe first power source line, and wherein the second N-type well iscoupled to the second power source line.
 3. The semiconductor deviceaccording to claim 2, wherein the first switch electrically couples thefirst power source line with the second power source line in an activemode and electrically decouples the first power source line from thesecond power source line in a standby mode, and wherein the controlsignal is for controlling the active mode and the standby mode.
 4. Thesemiconductor device according to claim 3, wherein the second switchelectrically couples the first power source line with the second powersource line in the active mode and electrically decouples the firstpower source line from the second power source line in the standby mode.5. The semiconductor device according to claim 1, further comprising: afirst internal power source circuit which supplies the first voltage tothe first power source line based on an external power source voltage;and a second internal power source circuit which supplies the secondvoltage to the second power source line based on the external powersource voltage.
 6. The semiconductor device according to claim 1,further comprising: a switch control circuit which controls the firstand second switches, wherein the switch control circuit includes a firstcontrol signal generation unit adapted to generate a first internalcontrol signal to be input into a gate of the first PMOS transistorbased on a voltage of the second power source line, and a second controlsignal generation unit adapted to generate a second internal controlsignal to be input into a gate of the second PMOS transistor based onthe control signal and a voltage of the first power source line.